multilayer ceramic chip capacitors 1 of 3 creation date : november 16, 2017 (gmt) CGA3E3X7S1A225M080AE tdk item description cga3e3x7s1a225mt***s applications automotive grade feature soft soft termination aec-q200 aec-q200 series cga3(1608) [eia 0603] status production size length(l) 1.60mm +0.20,-0.10mm width(w) 0.80mm +0.15,-0.10mm thickness(t) 0.80mm +0.15,-0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 2.2f 20% rated voltage 10vdc temperature characteristic x7s(22%) dissipation factor (max.) 7.5% insulation resistance (min.) 45m other soldering method wave (flow) re?ow aec-q200 yes packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 16, 2017 (gmt) CGA3E3X7S1A225M080AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance CGA3E3X7S1A225M080AE esr CGA3E3X7S1A225M080AE capacitance CGA3E3X7S1A225M080AE dc bias characteristic CGA3E3X7S1A225M080AE temperature characteristic CGA3E3X7S1A225M080AE(no bias) CGA3E3X7S1A225M080AE(dc bias = 5v) ripple temperature rising CGA3E3X7S1A225M080AE(100khz) CGA3E3X7S1A225M080AE(500khz) CGA3E3X7S1A225M080AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 16, 2017 (gmt) CGA3E3X7S1A225M080AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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